
Amazon · 7 hrs ago
$211 $238
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Covers the materials and processes behind chip interconnects, which makes it a solid pick for engineering students or semiconductor professionals needing a reference beyond general textbooks, and it's currently $27 off the $238 list price. Buy Now at Amazon
Features
- Copper damascene process integration for interconnect fabrication
- Low-k dielectric materials for reduced RC delay
- Barrier and seed layer deposition for metallization reliability
- Electromigration resistance enhancement for nanometer-scale wires
- Integration with chemical mechanical planarization techniques
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Price Analysis
|   | Discount | Last Deal Price | Current Price |   |
|---|---|---|---|---|
| Amazon | 11% | -- | $211 | Buy Now |








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